Electronics Support Facility

Microelectronics Facility

Microelectronics at SAC - Design, fabrication, test and delivery of space qualified components and subsystems for microwave and mm-wave circuits and systems which includes Surface Acoustic Wave (SAW) devices, Film Bulk Acoustic Resonator (FBAR) devices, MMICs, RF MEMS, mm-wave components, micro optics elements - Micro Lens Array, optical gratings, packaging technologies like MCM, LTCC, System in Package (SiP), Advanced System-on-Chip (SoC)/ Wafer Scale Packaging. It is also involved in fabrication and assembly of MIC, SAW and LTCC based subsystems:

• Thin film deposition, Substrate processing for MIC and SAW devices
• Microlithography for MIC and SAW devices – Optical, DWL, Mask fab, E-beam
• Assembly and packaging of MMIC, MIC, LTCC and SAW including LASER hermetic sealing